| Report Written: | 18:15 Thursday, April 23, 2026 |
| Project Path: | D:\uni work\2025\Group Proect\Pcb design RJ\t1.prj |
| Design Path: | D:\uni work\2025\Group Proect\Pcb design RJ\pcb_gp.pcb |
| Design Title: | |
| Created: | 22/04/2026 22:28:23 |
| Last Saved: | 23/04/2026 18:09:59 |
| Editing Time: | 488 min |
| Units: | mm (precision 3) |
| Tracks | No |
| Pads and Vias | No |
| Shapes | No |
| Text | No |
| Board | No |
| Drills | No |
| Components | No |
| Acid Traps | No |
| Component Area | No |
| Component Height | No |
| Component Names | No |
| Copper Text In Board | No |
| Drill Breakout | No |
| Drill Backoff | No |
| Min Annular Ring | No |
| Min Paste Size | No |
| Min Solder Mask Width | No |
| Min Solder Mask To Track | No |
| Min Text Size | No |
| Min Track Width | No |
| Max Stub Length | No |
| Mirrored Text | No |
| Modified Pour Area | No |
| Neck Length | No |
| Routing Areas | No |
| Silkscreen Overlap | No |
| Silkscreen Overlap | No |
| Same net via to SMD pad | No |
| Silkscreen Board Overlap | No |
| Silkscreen Board Overlap | No |
| Silkscreen Board Overlap | No |
| Silkscreen Board Overlap | No |
| Silkscreen Board Overlap | No |
| Undrilled through-hole pads | No |
| Unplated Vias | No |
| Unplated Pads With Inner Tracks | No |
| Unplated Pads | No |
| Unpoured Areas | No |
| Wires | No |
| Vias In Pads | No |
| Net Completion | No |
| Dangling Tracks | No |
| Net Track Length Differences | No |
| Nets without Components | No |
| Nets on No Connect pins | No |
| Single Pin Net | No |
| Max Vias on Net | No |
| Pcb-only Nets | No |
| Check Text Shapes | No |
| Check Where | Whole Design |
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